Xilence X5 - Thermal paste

Kód produktu ZUB-XPTP.X5
Výrobca Xilence
Záruka 12 Mesiaca
Výrobca
 
Unknown
APIDE
 
Unknown
DK773
 
12 Mesiaca
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Sklad ks Dodáme Cena
DPH
APIDE 1 19. 11. 2024 Upresníme 12,08
DK773  1  25. 11. 2024 Upresníme 21,45

Marketingový popis

Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C - therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware!

Product Description
Xilence X5 - thermal paste
Product Type
Thermal paste
Dimensions (WxDxH)
1.1 cm x 1 cm x 11 cm
Weight
2.5 g
Features
Non conductive
Product Type
Thermal paste
Width
1.1 cm
Depth
1 cm
Height
11 cm
Weight
2.5 g
Thermal Conductivity
1.46 W/mK
Features
Non conductive
Min Operating Temperature
-50 °C
Max Operating Temperature
300 °C