Mārketinga apraksts

Cooler Master HTK-002-U1 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

Galvenās priekšrocības

• Suitable for CPU, chipsets on Mainboard, VGA card, etc
• Easy to use
• Zif Socket Templates ensure correct applying area with various CPU socket types
• Produces an even layer when using applicator
• Dielectric
• Wide range of application temperature